A Method and Apparatus for Slicing Hard, Brittle Materials


Reference #:  00465

The University of South Carolina is offering licensing opportunities for this technology

Invention Description:

This novel invention involves both a method and apparatus for the slicing of ingots, particularly silicon carbide (SiC) and hard brittle materials. The cutting machine provides a high cutting speed of the ingot.

Advantages and Benefits:

There are many advantages to this technology, including the following:


(1)         the wafers produced by this method exhibit low total thickness variation and low depth of surface damage;

(2)         the proposed method is a single step process as opposed to current two-step process;

(3)         the surface after slicing is ready for polishing - no lapping step is required;

(4)         the system is easy to use and is simple in design; and

(5)         multiple crystals may be cut simultaneously


Potential Applications:

This method of slicing hard, brittle materials produces cuts from a bulk material, or wafers, from hard semiconductor ingots as well as other crystalline and ceramic materials.

Patent Information:
Title App Type Country Serial No. Patent No. File Date Issued Date Expire Date Patent Status
Methods, Wires, and Apparatus for Slicing Hard Materials Utility United States 12/205,046 8,291,895 9/5/2008 10/23/2012 6/6/2031  
For Information, Contact:
Technology Commercialization
University of South Carolina
Tangali Sudarshan
Igor Agafonov
Robert Kennedy
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